Philips Micro Devices

At Philips Micro Devices, we deliver complex Printed Circuit Board Assemblies (PCBA) and micro-systems for medical, photonic and high-tech markets, for both Philips and external partners. Using proven phase-gated development approach, scalable industrial processes, DfX principles, and advanced tools & libraries, we optimize manufacturability, Critical-to-Quality (CtQ) parameters, cost, and reliability in the crucial development phase.

Our micro-assembly lines are fit for development, prototyping as well as high-mix and volume production. With our know-how, experience, and systematic approach, we seamlessly can move from prototype to production released products at the right quality. Our ISO 9001 and ISO 13485 certification enables us to run high-tech and health-tech projects in a controlled manner. We work with standard processes (Advanced Development, Product Development and Lifecycle Management), highly skilled people, and a broad range of test and inspection equipment to assure that the quality of your products is guaranteed.

Our profile
Our profile
Serving high-end/low-volume markets in: healthcare, complex equipment OEMs, photonic and sensor integration

High capacity, supporting volume production.

Key process capabilities, such as PCB Assembly lines, micro-systems assembly, and semicon back-end processes.

Proven track record in successful transfers, from NPI to mass volume manufacturing.

A balanced load between our external customer projects versus Philips high-end projects.

Long lasting customer relationships with high customer satisfaction

Key certificates: ISO13485, ISO9001, ISO14001, ISO27001, ISO45001

Total operations area (incl. offices) of ~ 4.300 m2
Benefits
Benefits
Partnering with Philips Micro Devices assures your product is industrialized and manufactured with the required quality and reproducibility.

Wide experience in manufacturing technologies, e.g. PCBA, semiconductor packaging, photonics, sensor integration and medical devices.

Dedicated and flexible support: applying DfX principles (design-for-test, design-for-assembly, etc.).

Quality first: we follow design rules for high quality PCB Assembly. Development on production equipment enables smooth transfer from prototyping to production.

Extended design rules and footprints in addition to IPC standards, based on historical high volume production data.

Agile and transparent end-to-end execution, from design, prototyping to manufacturing.
Key capabilities
Key capabilities
Micro Devices capabilities in PCBA and Micro Assembly

Philips Micro Devices provides manufacturing and assembly services in the segments PCB assembly, verification & validation boards, micro assembly medical devices and photonic assembly.

PCB Assembly

Assembly of Verification & Validation Boards

Micro Assembly Medical Devices

Photonic Assembly

PCB Assembly Capabilities

Solder/Epoxy application

Screen printing, (non-)conductive epoxy jetting, epoxy dispensing

Solder Paste Inspection

Inline inspection, Volume, height, shape, position, bridging

Pick&Place

Flexible, 008004 to odd-size, tape & reel, tray

Reflow

Forced convection, 9 heating zones, 3 cooling zones, N₂

Inspection/ Testing

3D Automated Optical Inspection, 3D X-Ray, Flying Probe, Functional, BST

Other

Wave/selective and manual soldering

Micro (Opto-)Electronic Assembly Capabilities

Die attach

Die Attach Film, flip-chip, fluxless soldering, Adhesive bonding, equipment accuracy range 1.5μm - 7μm.

Bonding/ Interconnect

Au and Al wire bonding, Anisotropic Conductive Film (ACF), Thermocompression Bonding, fluxless soldering, Solderball Jetting

Environmental protection

Underfill, encapsulation, spray coating (PDMS/conformal), parylene coating

Active Optical Alignment

Chip-to-fiber, fiber-to-laser, Optimalization for attenuation, beam shape, beam position, sub-micron accuracy

Optical fiber processing

(Angled) Cleaving, (PM) fusion splicing, tapering, connectorization

Device Integration

Surgical tools, catheters, patches, print heads, micro fluidic cartridges

Test, Verification, Characterization

Bond strength, Ray-tracing simulations, 3D-Xray, environmental testing

Sensor Integration

Handling of Micro Components

(Custom) Micro grippers, vacuum nozzles

Accurate Positioning

Industrial Equipment, Custom Tooling, passive and active alignment

Bonding/ Interconnect

Glue dispensing/ printing/ jetting, soldering (SMT,wave,manual), ACF, thermo-compression bonding, solderball jetting, wire bonding

Environmental protection

Underfill, Glob-top, Dam&fill, Coating

2D -> 3D

Folding, Thermoforming

Test, Verification, Characterization

Electrical, Acoustical, Optical testing, 3D X-ray, Mechanical
Expected outcomes
Expected outcomes
De-risked process at the end of Advanced Development.

Customer intimacy due to close cooperation throughout all project stages.

DfX analysis supporting evidence-based decision making

Successful transition to production by ensuring your Manufacturing Readiness Level advances in tandem with your Technology Readiness Level.
Why now
Why now
Philips Micro Devices supports its customers in prototyping, New Product Introduction (NPI), and production needs in Printed Circuit Board Assembly (PCBA) and micro assembly.

Technological advancements: Rapid advancements in medical, photonic and electronic industries necessitate robust and efficient development and manufacturing solutions. Philips Micro Devices ensures that start-ups and OEMs can bring innovations to market swiftly and reliably.

Economic pressures: Companies face increasing pressure to reduce costs while improving quality and functionality. Philips Micro Devices offers first-time-right prototyping, NPI and production that reduces spending in Advance Development and Product Life Cycle Management stages.

Time-to-market pressure: With the severe competition, companies are challenged with their time-to-market objectives. Using proven phase-gated development approach, scalable industrial processes, Philips Micro Devices accelerates prototyping/NPI and manufacturing for fast market launches.

Regulatory pressure: Stricter regulations compel healthcare providers and manufacturers to adopt cutting-edge solutions for patient safety and data integrity. Philips Micro Devices' disciplined approach to prototyping/NPI and manufacturing helps navigate these regulations efficiently.

Structured and phase-gated development approach

We use a proven phase-gated development approach in (pre-)development and industrialization, with scalable industrial processes and technologies, leveraging our industrial tools and process libraries.
We apply design-for-excellence principles to address critical-to-quality parameters and processes.
We work in close cooperation with you, through an open dialog and clear communication.

Featured Manufacturing Services

Printed Circuit Board Assembly

System Integration / Box Build

Micro-System Assembly


Proposition
Ensuring high repeatability and high yield in low volume orders over the full lifetime of a product.	In collaboration with our Innovation Engineering team (IEN): One stop shop for Product and Process Development and Manufacturing	Proven track-record in developing and running volume manufacturing processes for components for Sensor integrated Devices
Typical Application Areas
Complex PCBAs for High-tech Equipment, Medical, Semi-Conductor, Defense Verification and Validation boards for Semi-Conductor components, Medical, Communication, Consumer Electronics, MEMS, Automotive	Medical Devices, Start-ups and Ventures System build for OEM Equipment, Medical	Sensor integration for Medical Devices, MEMS elements, Optics based sensors, Ultrasound Transducers, Micro Fluidic elements R&D Packaging and Micro Assembly Services, Communication, Automotive
Key Enabling competencies
State-of-the-art Surface Mount Technology (SMT)/Through Hole Technology (THT) equipment Highly skilled and experienced team ISO 13485 certification Electronic design & layout services Reliability Analysis, Pred-X, Testway Component Management SAP MES implemented Combination of SMT and Semi-Conductor packaging capabilities	State-of-the-art Surface Mount Technology (SMT)/Through Hole Technology (THT) equipment ISO 13485 certified Process Development Electronic design & layout services Mechatronics design services Component Management Optical Fiber processing Programming / Testing	State-of-the-art equipment ISO 13485 certification Micro Assembly Competencies 2D-to-3D Assembly Active Optical Alignment Optical Fiber Processing Combination of SMT and Semi-Conductor packaging Wafer level Flex-to-Rigid (F2R) Assemblies

Documentation

Resources: To-test or not-to-test, Balancing costs between testing and quality: (2.5MB)

Existing and proven semiconductor assembly processes: (2.04MB)
Video assets: Proof Points of Manufacturing Excellence at Philips Micro Devices

Your challenges are our priority.
We're eager to connect with you to help you elevate your manufacturing success!

Contact

Ercan Şengil

Business Development Manager

ercan.sengil@philips.com

Folkert Morsheim

Customer Relations Manager

f.h.morsheim@philips.com

Support

your manufacturing partner

Partnering with Philips Micro Devices assures your product is industrialized and manufactured with the required quality and reproducibility.

Micro Devices capabilities in PCBA and Micro Assembly

PCB Assembly Capabilities

Micro (Opto-)Electronic Assembly Capabilities

Sensor Integration