Die attach
Die Attach Film, flip-chip, fluxless soldering, Adhesive bonding, equipment accuracy range 1.5μm - 7μm.
Bonding/ Interconnect
Au and Al wire bonding, Anisotropic Conductive Film (ACF), Thermocompression Bonding, fluxless soldering, Solderball Jetting
Environmental protection
Underfill, encapsulation, spray coating (PDMS/conformal), parylene coating
Active Optical Alignment
Chip-to-fiber, fiber-to-laser, Optimalization for attenuation, beam shape, beam position, sub-micron accuracy
Optical fiber processing
(Angled) Cleaving, (PM) fusion splicing, tapering, connectorization
Device Integration
Surgical tools, catheters, patches, print heads, micro fluidic cartridges
Test, Verification, Characterization
Bond strength, Ray-tracing simulations, 3D-Xray, environmental testing